The difference between SMT patch and DIP plug-in

SMT patch is generally mounted with no-lead or short-lead surface assembly components. It is necessary to print solder paste on the circuit board, then mount it through a placement machine, and then fix the device through reflow soldering. The DIP welding is a direct-insertion packaged device, which is fixed by wave soldering or manual soldering.

Both SMT and DIP are part of PCBA processing, but not all PCBA factories have SMT PCB assembly and the processing quality is also uneven. When choosing a PCBA factory for cooperation, it is recommended to go to the factory for on-site inspections to see the factory personnel skills, processing equipment, and the overall environment of the factory.


SMT stands for "Surface Mount Technology" , which is the most popular technology and process in the electronics assembly industry currently . It is a circuit assembly technology in which surface mount components are mounted on the surface of a circuit board or the surface of other substrates, and are soldered and assembled by methods such as reflow soldering.
So what are the differences between SMT and DIP? Features of SMT patch:  
1. SMT patch assembly density is high, small size and light weight: the volume and weight of SMD components are only about 1/10 of that of traditional DIP plug-in components. After adopting SMT, the volume of electronic products is reduced by 40%-60%, and the weight is reduced by 60%. %—80%;  
2. The PCBA quality performance of SMT patch welding is stable: the solder joints are firm and reliable, the anti-vibration ability is strong, and the solder joint defect rate is low;
3. PCBA soldered by SMT patch has stable electrical properties and low energy consumption: short parts and wiring, fast transmission and low energy consumption, reducing electromagnetic and radio frequency interference, and high-frequency characteristics are stable and reliable;
4. SMT patch is easy to realize automation, improve production efficiency, save materials, energy, equipment, manpower and time, and reduce costs by 30%-50%.
DIP plug-ins have manual plug-ins and AI machine plug-ins. Manual plug-ins have to be wave soldered to solder the electronic components on the board.
DIP plug-in has the following characteristics, suitable for perforation welding on PCB circuit board, easy to operate. The difference between SMT and DIP, analyzed from the perspective of assembly process technology, the fundamental difference between SMT and DIP is "sticking" and "inserting". The difference between the two is also reflected in the substrate, components, component shape, solder joint shape and assembly process All aspects of the method.

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