The impact of the communications industry on the PCB industry in the 5G environment
The arrival of 5G is the beginning of the real interconnection of everything. 5G will complete the interconnection of everything in the world. With the advent of the 5G era, PCBs for communication will also have a great time!
Opportunities for FPC, HDI, and multilayer boards are coming, and the growth rate is obvious
There are many PCB classifications. At present, the use of multi-layer boards and FPCs is the most used in the use of PCBs. According to relevant predictions, with the development and changes of future application scenarios, the 5G era, the upgrade of smart phones, the rise of the Internet of Things, and the complexity of automotive electronics A series of downstream industry changes and upgrades such as the improvement of the degree of production. FPC, HDI, and multilayer circuit board will be the main beneficiaries. The growth rate is obvious. In the CAGR of various PCB products from 2016 to 2021, HDI boards, soft boards, and multi-layer boards will perform Eye-catching, 2.8%, 3.0%, 2.4% respectively.
Communications, consumer electronics, and automotive electronics are the main drivers of future growth
Looking at PCB from the downstream demand side, the development of the PCB industry is inseparable from the support of the development of downstream applications. In recent years, it has mainly benefited from the increased demand in consumer electronics, communications, automotive electronics, industrial control and medical applications. At present, in the context of the imminent 5G, 5G base station construction plans are clear, hot spots in the consumer electronics industry are frequently appearing, and innovations in automotive electronics, industrial control medical, and computers are constantly innovating. The corresponding downstream application fields of PCB will continue to benefit from 5G.
In 2018, the downstream PCB application market was mainly concentrated in the fields of computers, communications, and consumer electronics, with less than 10% of the automotive, industrial control medical, military aerospace, and packaging substrates. Industry insiders predict that the contribution of downstream applications to PCB CAGR from 2018 to 2022 will be mainly concentrated in communications, consumer electronics, and automotive electronics.
High-frequency and high-speed PCB boards in the 5G environment will benefit significantly
At present, the communication field is the largest downstream of PCB. According to relevant data, the output value of PCB in the global communication electronics field reached 17.8 billion US dollars in 2017, accounting for 30.3% of the total output value of the global PCB industry, and the proportion has continued to increase over the years. In 2017, the output value of electronic products in the PCB downstream communication electronics market was 567 billion US dollars, and it is expected to maintain a compound growth rate of 2.9% in the next 5 years. The PCB demand for communication equipment is mainly high-multilayer boards (8-16 layer boards account for about 35.18%), and there is a demand for 8.95% of packaging substrates.
The application requirements of the communication network itself for the PCB board are mainly in the four major areas of wireless network, transmission network, data communication and fixed network broadband. In the early stage of 5G construction, the increase in demand for PCBs is directly reflected in the wireless network and transmission network, and there is a greater demand for PCB backplanes, high-frequency boards, and high-speed multilayer boards. In the middle and late stages of 5G construction, with the accelerated penetration of 5G high-bandwidth business applications, such as mobile high-definition video, Internet of Vehicles, AR/VR and other business applications, it will also have a greater impact on the data processing and exchange capabilities of the data center. It is expected that after 2021, domestic data centers will be upgraded from the current 10G, 40G to 100G, 400G ultra-large data centers, and the demand for high-speed multilayer boards in the data communication field will increase rapidly.
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