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POE PCB Assembly


POE 3000M2  Turnkey PCB Assembly New Factory is Running!

POE offers turn-key PCB assembly services OEM in prototype quantities or low-volume to mid-volume production runs.
 
We handle the whole process including: ordering all the components, PCB manufacturing, PCB assembly, testing and final shipment.
 
We are capable of assembling BGA, Micro-BGA, QFN and other leadless package parts.

Component Partner

Component Partner

PCBA Finished Product Display


*Learn about PCB Assembly>>>


PCB Assembly Services


What we can do for you?

SMT and Through-Hole Assembly

Lead free Assembly

One-stop PCB Assembly

Prototype PCB Assembly

BGA and QFN Assembly

PCB Assembly in low volumes

Kitting and 3D printing
 

Fine Pitch Component Insertion

BGA X-Ray Inspection

Automated Optical Inspection

PCB testing for functionality

Selective Wave Soldering

Complete box build

Conformal Coating
 

X-Ray & AOI Testing

Checks for solder paste 

Checks for components down to 0201" 

Checks for missing components, offset, incorrect parts, polarity

X-Ray Inspection

X-Ray provides high-resolution inspection

In-Circuit Testing

In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems.

Power-up Test

Advanced Function Test

Flash Device Programming

Functional testing

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Quick PCB & PCBA

Can Evaluate,Test and Prototyping

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Quick PCB & PCBA

POE focus on producing HDI PCB


PcbaMake focus on producing HDI PCBHDI PCB by PcbaMake

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PCB Assembly Production Process

 PCB Assembly Production Process | PcbaMake

PCB Fabrication


POE PCB manufacturing factory uses a tightly controllable process to ensure all PCB quality and leadtime. Learn about PCB Fabrication >>>

Incoming Material Inspection


POE  Parts Procurement team works concurrently with our PCB Fabrication team to ensure that all assembly materials are received and ready for use as soon as the bare PCBs are ready for assembly. As parts are received at POE production facility, our Incoming Quality Control (IQC) team conducts a thorough inspection before warehousing any particular material or component.

Inspections include sample operational testing as well as date code verification and entry into a software material management system. Our sophisticated software management system ensures that rules of first-in-first-out are strictly followed, and that parts used in PCB Assembly are always in good working order.

SMT Solder Paste Screening


The first step in the actual PCB Assembly process is the application of solder paste to the bare PCBs. Here the stainless-steel stencil that was created during PCB Fabrication is fit over the bare board, leaving only the pads for assembly of surface-mount components uncovered. The stencil is held in place by a mechanical fixture, and an applicator moves over the surface of the board to meticulously distribute solder paste over those uncovered spaces.

POE quality control team then performs a thorough inspection to ensure that the solder has only been applied to the necessary areas, and that all pads are covered with a sufficient amount of paste. For double-sided SMT boards, this process will need to be performed individually for each side, as indicated in the above flowchart.

POE solder of choice is DELTA the best solder paste in China and worldwide , which is a Lead-Free alloy containing 96.5% tin, 3% silver, and 0.5% copper, and is compliant with the RoHS, REACH, and JEIDA directives. We use the paste version of this material for reflow soldering, and solid versions for manual and wave soldering.

POE Drilling Machines

POE Drilling Machines

Copper Plating Process

Copper Plating Process

OUTLINE Machine

OUTLINE Machine

Multilayer innercircuit Xray checking

Multilayer innercircuit Xray checking

Fully Automatic E-test process for PCB mass production

Fully Automatic E-test process for PCB mass production

Quality Tester

Quality Tester

Customers visit POE PCB assembly factory

Customers visit POE PCB assembly factory

DELTA solder

DELTA solder

Machine Placement


Once solder paste is applied to the bare PCBs, they are moved to POE’s automated Pick & Place machines for the actual mounting of components on their associated pads. Part placement is 100% machine automated for maximum accuracy and efficiency, and uses the project’s pickplace file for component coordinates and rotation data. The boards are again inspected after components have been mounted to ensure all placements are accurate before the soldering process begins.

This stage might need to be performed multiple times, depending upon the specifics of a given project. Double-sided SMT boards require one round of placement for the top and one for the bottom, and projects requiring wave soldering due to a high number of through-hole parts will normally have their components machine-placed as well.

POE’s automated Pick & Place machines

POE’s automated Pick & Place machines

Reflow Soldering


For double-sided SMT projects, the boards will need to be reflowed once for each side. A special adhesive is applied underneath the components that were soldered in the first run to prevent them from detaching and falling off the board when their solder is re-heated.Most of the time, POE can use reflow soldering for a majority of the components on a board, and then pass the mostly-assembled boards to our highly skilled manual soldering team for the final few connectors.

The main concern in reflow soldering is that components must withstand high levels of heat for a more prolonged period of time than what would be required for either wave or manual soldering. The vast majority of modern SMT components are designed with these heat profiles in mind, but many through-hole components are not suited to reflow soldering for this reason. POE standard reflow cycle is described by the graph below.

Pre-heat to 150 in 60 seconds
Soak from 150 °C to 165 °C in 120 seconds
Reflow Peak temperature 245 °C hold for 20 seconds
Cooling -4 °C per second to room temperature
We have lOtime zones and 8 time zones, all is ROHS
POE’s Reflow Oven

POE’s Reflow Oven

POE's smt engineer

POE's smt engineer

POE’s AOI inspection machines AOI Automatic Optical Inspection


POE new AOI automatic optical inspection machines are running now for both prototype PCB and mass production. POE 100% AOI tested PCBAs:Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects.

SMT inspection AOI is for a PCB board with components may inspect the following features:

Area defects Flipped component Severely Damaged Components
Billboarding Height Defects Tombstoning
Component offset Insufficient Paste around I Leads Volume Defects
Component polarity Insufficient Solder Joints Wrong Part
Component presence or absence Lifted Leads Solder Bridging
Component Skew No Population tests Presence of Foreign Material on the board
Excessive Solder Joints Paste Registration  

AOI can be used in the following locations in the SMT lines: post paste, pre-reflow, post-reflow, or wave areas.

AOI

POE AOI inspection machines

X-Ray Inspection


After a reflow cycle, any boards including BGA, QFN, or other lead-less package types are sent for X-Ray Inspection.

X-Rays penetrate the silicon of an IC package and reflect from the metal connections underneath, forming an image of the solder joints themselves that can be analyzed by advanced image processing software similar to Automated Optical Inspection (AOI). Higher-density features in the captured area create a darker resulting image, allowing for quantitative analysis to determine quality of the solder joints and compare against industry standards.

Not only does X-Ray inspection detect issues in PCB assembly, but the analysis of an X-Ray image can help to determine the root cause of a given defect, such as insufficient solder paste, skewed part placement, or improper reflow profile.

POE X-Ray machines

POE X-Ray machines

Wave Soldering


Wave soldering is a method of PCB Assembly that involves sending boards on a conveyor through a “wave” of molten solder. The solder bonds together exposed component pads and leads while wicking off of the bodies of components and the solder masked bulk of the board.

Wave soldering has fallen somewhat out of favour in the PCB assembly industry in recent years, at least in comparison to its past prevalence.

The growing popularity of surface mount parts and High-Density Interconnect (HDI) PCB layouts make reflow soldering the method of choice for a majority of projects, and manual soldering can be used to take care of the typically few components not suitable for reflow.

That being said, wave soldering certainly still has its place. For legacy boards requiring high proportions of Through-Hole Assembly, as well as boards incorporating large connectors with very high pin counts, wave soldering is often still the most efficient method for PCB assembly.

Wave Soldering

Wave Soldering

manual soldering by PcbaMake

manual soldering

Manual Soldering


Manual soldering is generally used when a PCB design incorporates some parts that are not suitable for either reflow or wave soldering.

For example, a majority surface mount PCB might include a few through-hole components, and wave soldering these few parts would unnecessarily drive up the cost of production.

POE employs a staff of highly skilled manual soldering specialists to take care of any such requirements, who provide consistent and reliable workmanship even up to IPC-A-610 Class 3 Standards.

  • Multiple-row connectors (more than 2 rows) cannot be manually soldered since the tip of a soldering iron will not fit between rows; these devices are usually wave soldered.
  • BGA, QFN, and other lead-less packages cannot be manually soldered.
  • Part-to-Part Spacing* and Part-to-Hole Spacing* requirements must be carefully observed, and an additional margin of 5 to 10 mil is recommended around any manual assembly parts.
  • Pad and Hole Size* requirements must be strictly followed, and an additional margin of 10% is strongly recommended for the SMT pad-to-lead ratio of manual assembly parts.
Bulky components

Bulky components

POE manual assembly team

POE manual assembly team

Final Inspection


As noted above, inspections are carried out after every individual stage of the PCB assembly process to better localize the source of any error.

POE views these intermediary inspections necessary but not sufficient to fully guarantee the highest in quality of workmanship, as is our mission, and as such we always perform a thorough final inspection on the fully finished boards at the end of the process.

These final inspections always include visual inspection by POE highly experienced quality assurance team, and Automated Optical Inspection (AOI)for complex or high-volume projects.

We can also provide additional services such as Functional Circuit Testing (FCT) and In-Circuit Testing (ICT) upon client request.

The more involved testing methods of ICT and FCT will require some additional lead time and labour cost depending upon the specific requirements for a given project, but can relieve the need for involved product testing on the client end.

manual assembly
                       manual assembly
POE Bulk PCB finished products

Bulk PCB finished products

POE PCBA Production Equipment


Pick & Place Machine

Pick & Place Machine 1

Pick & Place Machine 2

Automatic Solder Paste

Automatic Solder Paste 1

AOI

Wave Soldering

Reflow Oven

Pikc & Place Machine

Automatic printing machine

Reflow soldering

Plate washer