POE 3000M2 Turnkey PCB Assembly New Factory is Running！
POE offers turn-key PCB assembly services OEM in prototype quantities or low-volume to mid-volume production runs.
We handle the whole process including: ordering all the components, PCB manufacturing, PCB assembly, testing and final shipment.
We are capable of assembling BGA, Micro-BGA, QFN and other leadless package parts.
What we can do for you？
•Lead free Assembly
•One-stop PCB Assembly
•Prototype PCB Assembly
•BGA and QFN Assembly
•PCB Assembly in low volumes
•Kitting and 3D printing
•BGA X-Ray Inspection
•Automated Optical Inspection
•PCB testing for functionality
•Selective Wave Soldering
•Complete box build
•Checks for solder paste
•Checks for components down to 0201"
•Checks for missing components, offset, incorrect parts, polarity
•X-Ray provides high-resolution inspection
•In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems.
•Advanced Function Test
•Flash Device Programming
After a reflow cycle, any boards including BGA, QFN, or other lead-less package types are sent for X-Ray Inspection.
X-Rays penetrate the silicon of an IC package and reflect from the metal connections underneath, forming an image of the solder joints themselves that can be analyzed by advanced image processing software similar to Automated Optical Inspection (AOI). Higher-density features in the captured area create a darker resulting image, allowing for quantitative analysis to determine quality of the solder joints and compare against industry standards.
Not only does X-Ray inspection detect issues in PCB assembly, but the analysis of an X-Ray image can help to determine the root cause of a given defect, such as insufficient solder paste, skewed part placement, or improper reflow profile.
POE X-Ray machines
Wave soldering is a method of PCB Assembly that involves sending boards on a conveyor through a “wave” of molten solder. The solder bonds together exposed component pads and leads while wicking off of the bodies of components and the solder masked bulk of the board.
Wave soldering has fallen somewhat out of favour in the PCB assembly industry in recent years, at least in comparison to its past prevalence. The growing popularity of surface mount parts and High-Density Interconnect (HDI) PCB layouts make reflow soldering the method of choice for a majority of projects, and manual soldering can be used to take care of the typically few components not suitable for reflow.
That being said, wave soldering certainly still has its place. For legacy boards requiring high proportions of Through-Hole Assembly, as well as boards incorporating large connectors with very high pin counts, wave soldering is often still the most efficient method for PCB assembly.
Manual soldering is generally used when a PCB design incorporates some parts that are not suitable for either reflow or wave soldering. For example, a majority surface mount PCB might include a few through-hole components, and wave soldering these few parts would unnecessarily drive up the cost of production. POE employs a staff of highly skilled manual soldering specialists to take care of any such requirements, who provide consistent and reliable workmanship even up to IPC-A-610 Class 3 Standards.
POE manual assembly team
As noted above, inspections are carried out after every individual stage of the PCB assembly process to better localize the source of any error. POE views these intermediary inspections necessary but not sufficient to fully guarantee the highest in quality of workmanship, as is our mission, and as such we always perform a thorough final inspection on the fully finished boards at the end of the process.
These final inspections always include visual inspection by POE highly experienced quality assurance team, and Automated Optical Inspection (AOI)for complex or high-volume projects. We can also provide additional services such as Functional Circuit Testing (FCT) and In-Circuit Testing (ICT) upon client request. The more involved testing methods of ICT and FCT will require some additional lead time and labour cost depending upon the specific requirements for a given project, but can relieve the need for involved product testing on the client end.
Bulk PCB finished products
Pick & Place Machine
Pick & Place Machine 1
Pick & Place Machine 2
Automatic Solder Paste
Automatic Solder Paste 1
Pikc & Place Machine
Automatic printing machine