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SMT PCB Service Features

New automatic SMT solder paste printing machine
Advanced high speed assembly machine
SMT PCB stencil service can be provide
Strictly control the soldering quality
Each SMT line is equipped with automatic AOI detection machine
X-Ray machine plays a key role in BGA inspection
Inspection report can be exported for you reference

SMT PCB Solutions

POE offers full Turn-Key and partial Turn-Key Circuit Board Assembly Services. We focus on both rigid PCB Assembly and flex PCB assembly. Our quality driven PCB assembly process ensures that your finished project is of the highest quality.

In Full Turn-Key PCB, we handle everything including making circuit boards, ordering components, quality inspection and final assembly.  In partial Turn-Key, you can order the PCBs and partial components, we will fix the remaining parts for you.

POE PCBA Capabilities

Service Category Supported Capabilities
Types of Assembly THD (Thru-Hole Device) (Automatic Assembly in POE)
SMT (Surface-Mount Technology) (Automatic Assembly in POE)
SMT  & THD mixed (Automatic Assembly in POE)
2 sided SMT and THD assembly (Automatic Assembly in POE)
Order quantity 1 to 50,000 boards
Components Passives parts, smallest size 01005, 0201
Fine pitch to 8 Mils
BGA, uBGA, QFN,POP and Leadless chips
Connectors and terminals
Component Package Reels
Cut tape
Tube and tray
Loose parts and bulk
Board dimensions Smallest size: 0.2" x 0.2"
Largest size: 15" x 20"
Board shape
Slots and Cut outs
Complex and Irregular
Board type Rigid FR-4
Rigid-Flex boards
Assembly process Leaded process
Lead-Free (RoHS)
Design file format Emails
Phone calls
Web online quotation for PCB and assembly
Electrical testing X-ray Inspection
AOI (Automated Optical Inspection)
Functional testing
Oven profile Standard
Turnaround time 1-5 days for only PCB assembly (quick turn 1day)
10-16 days for turnkey PCB assembly (including components)

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POE PCBA Manufacturing Capabilities

Visual inspection: general quality check.

FAI: full quality check applied to the first PCB to pass through all stages of production.

X-ray Inspection: checks for BGAs, QFN and bare circuit boards.

AOI Testing: checks for solder paste, 0201 components, missing components and polarity.

3D AOI Testing: checks for missing and misplaced SMT components in three dimensions.

3D SPI Testing: measures the precise volume of solder paste for SMT assembly.

ICT (In-Circuit Test).

Functional test (Following your test procedures).

PCBA Manufacturing Capabilities /Full Turn-Key PCB

SMT PCB Manufacturing Video