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BGA PCB Assembly Services

Precision BGA assembly for complex and high-density PCBs, with controlled reflow, X-ray inspection, BGA rework and reballing.

Fine-Pitch BGA 01005 Components X-Ray Inspection BGA Rework & Reballing
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BGA PCB Assembly Services

BGA Assembly Capabilities

PCBAMake provides BGA assembly for complex PCB designs requiring high component density and fine-pitch placement. Our process combines precision SMT placement, controlled reflow and X-ray inspection to verify hidden solder joints.

BGA Packages We Support

BGA / μBGA / CSP / Fine-Pitch Packages

  • BGA Pitch0.25 mm*
  • Component Size01005 to Large BGA
  • InspectionX-Ray + AOI
  • ReflowControlled Thermal Profiles
  • PackagesBGA / μBGA / CSP
  • ReworkBGA Rework & Reballing

*Capability should be confirmed based on the specific PCB design, package and production requirements.

BGA assembly Process

PCB & BOM Review
01
PCB & BOM Review
Review PCB data, BGA footprints, component specifications and assembly requirements before production.
Stencil Printing
02
Stencil Printing
Apply solder paste with controlled printing parameters to achieve consistent paste deposition.
Precision Placement
03
Precision Placement
Automated placement equipment accurately positions BGA and fine-pitch components.
Controlled Reflow
04
Controlled Reflow
Apply an optimized thermal profile to achieve reliable solder joints across the BGA package.
X-Ray Inspection
05
X-Ray Inspection
Inspect hidden BGA solder joints for potential defects that cannot be identified through visual inspection.
Testing & Rework
06
Testing & Rework
Complete functional inspection and BGA rework or reballing when required.

BGA Quality Control & Inspection

Because BGA solder joints are hidden beneath the package, process control and appropriate inspection are critical to assembly quality. PCBAMake uses multiple inspection and testing methods throughout the assembly process.

SPI
SPI
Solder paste printing verification
AOI
AOI
Component placement and visible solder inspection
X-Ray
X-Ray
Hidden BGA solder joint inspection
FAI
FAI
First Article Inspection
Functional Testing
Functional Testing
Electrical and functional verification based on project requirements
Rework Inspection
Rework Inspection
Verification after BGA rework when required

BGA Assembly for
Complex PCB Projects

Suitable for high-density and fine-pitch PCB assemblies used in industrial control, communications, medical electronics, automation and other demanding applications.

Complex PCB Projects

Complete PCBA Support

BGA assembly can be integrated with PCB fabrication, component sourcing, SMT/THT assembly, testing, programming and box build services.

PCB ➔ Components ➔ PCBA ➔ BGA ➔ Testing ➔ Box Build
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FAQ

Q

How long have you been making PCB&PCBA?

A

PCBAMake has been making PCBs for more than 26 years. We built our assembly plant and begin assembly business in 1996.

Q

How do I get a quick quote for PCB or PCB assembly?

A

Please send your files and requirements to Orders@pcbamake.com . Quote will be sent back as soon as we get through an evaluation.

Q

Do you cater SMT prototype boards?

A

Yes, we are fully equipped to handle your any kind of custom SMT prototype board requirements. MOQ is 10 PCS.

Q

What files and documents do you request for my PCBA orders?

A

To ensure accurate and efficient assembly, we require Gerber files (including all layers), a complete Bill of Materials (BOM) in Excel format, Centroid data (Pick and Place file), and any additional requirements or assembly instructions if applicable.

WHAT CAN I DO FOR YOU ?

  * Only zip or rar files accepted. Max 18MB.

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