PCBA SMT processing is very complicated and includes multiple important processes, such as PCB board manufacturing process, component procurement and inspection, SMT assembly, DIP, and PCBA testing. Among them, PCBA testing is the most critical quality control step in the entire PCBA processing process. The testing determines the final performance of the product.
Our strengths in PCBA Testing
Visual inspection: general quality check.
FAI: full quality check applied to the first PCB to pass through all stages of production.
X-ray Inspection: checks for BGAs, QFN and bare circuit boards.
AOI Testing: checks for solder paste, 0201 components, missing components and polarity.
3D AOI Testing: checks for missing and misplaced SMT components in three dimensions.
3D SPI Testing: measures the precise volume of solder paste for SMT assembly.
ICT (In-Circuit Test)
Functional test (Following your test procedures)
FAI: full quality check applied to the first PCB to pass through all stages of production.
X-ray Inspection: checks for BGAs, QFN and bare circuit boards.
AOI Testing: checks for solder paste, 0201 components, missing components and polarity.
3D AOI Testing: checks for missing and misplaced SMT components in three dimensions.
3D SPI Testing: measures the precise volume of solder paste for SMT assembly.
ICT (In-Circuit Test)
Functional test (Following your test procedures)