•Time Domain Reflectometer Test (TDR)
The Key to Guarantee PCB functional by SMT Test
PCBA SMT processing is very complicated and includes multiple important processes, such as PCB board manufacturing process, component procurement and inspection, SMT assembly, DIP, and PCBA testing. Among them, PCBA testing is the most critical quality control step in the entire PCBA processing process. The testing determines the final performance of the product.
Visual inspection: general quality check.
FAI: full quality check applied to the first PCB to pass through all stages of production.
X-ray Inspection: checks for BGAs, QFN and bare circuit boards.
AOI Testing: checks for solder paste, 0201 components, missing components and polarity.
3D AOI Testing: checks for missing and misplaced SMT components in three dimensions.
3D SPI Testing: measures the precise volume of solder paste for SMT assembly.
ICT (In-Circuit Test)
Functional test： (Following your test procedures)
We use AOI to check the inner layers of multilayer PCB. This inspection is much more reliable and repeatable than manual visual inspection and it will guarantees the high reliability of multilayer circuit boards. AOI visually scans the surface of the PCB. The circuit board is lit by several light sources and observed by a scanner or by a number of high definition cameras. This enables the monitoring of all areas of the printed circuit board. AOI for a bare PCB board inspection will detect the features include:
PCB In-Circuit Test (ICT) is a technique that uses probes to test the functionality of an assembled PCB. Perform this ICT test to check for shorts or open circuits in assembled electronic circuits. This technique can also help determine the functionality of a PCB by validating factors such as current, voltage, resistance, temperature, etc. by validating the calculated design values. It ensures that the functional values of these factors match the calculated factors to ensure proper functionality.
ICT provides OEM customer such benefits as:
An Application Specific Integrated Circuit (ASIC) is an integrated circuit specially designed for a specific application, and testing these circuits on a printed circuit board becomes a very critical and complex task. This is where burn-in testing comes into play.
ASIC reliability is checked by performing burn-in testing techniques. This test method is typically performed at a temperature of 125°C (257°F). Tests are performed when power and electrical signals are applied to these specialized ICs.
Basically, this technique is performed before the different components are used. In this testing method, components are stress tested. This helps ensure component and PCB reliability.
During burn-in testing, ICs placed on the board are put under enormous stress. This helps identify defects and failures. These boards are able to withstand high temperatures during testing. During this process, the temperature remains as high as 257°F (125°C). Again, during this process, the boards are placed in an aging oven. Provide the necessary voltage for the sample to be tested. After completing this stress test, the samples will be screened. This helps make sure they pass the oven test.