What is the reason for the lack of glossiness of smt solder joints?
In smt production, many customers have certain requirements for the glossiness of solder joints. If it is found that the glossiness of the solder joints is not enough during the inspection process, the product can be defined as unqualified, so what is the reason for the lack of glossiness of the solder joints of smt?
1. The tin powder in the solder paste is oxidized, which reduces the glossiness of PCBA solder joints.
2. The solder paste itself contains additives that can form a matting effect.
3. The preheating temperature of reflow soldering in SMT chip processing is insufficient and does not reach the expected standard value, which will cause some difficult-to-evaporate to remain on the surface of the solder joints, resulting in insufficient gloss of the SMT solder joints.
4. After the SMT soldering process, there are rosin or resin residues on the solder joints. Generally, no-clean solder paste is used. Although the solder paste of these solder pastes will make the solder joints brighter, their residues in actual operation It often affects the glossiness of solder joints in PCBA patch processing.
5. There is no clear standard for the glossiness of solder joints in SMT chip processing. For example, there must be a certain difference between silver-free solder paste welding products and silver-containing solder paste welding products.
PCBAMake manufacturers will provide different solder paste options in the SMT PCB production process according to customer needs. As the requirements for environmental protection standards become higher and higher, the selection of SMT chip processing auxiliary materials such as solder paste also has corresponding environmental protection level requirements. More The application of lead-free solder paste and no-clean solder paste is becoming more and more popular and applied.
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