PCB Assembly Service
POE is one of the word's top PCB board turnkey PCB assembly manufacturer.We are the word leading EMS PCB manufacturer specialize in printed circuit board,PCB assembly,PCB/PCBA prototype in China,and offering turnkey PCB Assembly services including quick turn PCB,component sourcing,cable assembly,comprehensive PCB testing,final pacage,wordwide shipping etc.
POE provides PCB assembly, low to medium MASS production volume. Our professional SMT factory has advanced equipment, such as the world-class stencil printing, SMT chip pick & place, solder reflow, and in-line testing and steel mesh manufacturing. AOI test machine and X-ray testing machines for quality check.
POE offers turn-key PCB assembly services OEM in prototype quantities or low-volume to mid-volume production runs. We handle the whole process including: ordering all the components, PCB manufacturing, PCB assembly, testing and final shipment. We are capable of assembling BGA, Micro-BGA, QFN and other leadless package parts.
PCB Assembly Advantage
POE Provides OEM Turnkey PCB Assembly Service
Support you One Stop services of PCB fabrication, assembly, component procurement from prototype to mass quantity.
Our state-of-the-art printed circuit board assembly equipment and processes lead the EMS industry in technical capability, quality and efficiency.
Our certified IPC 610 trainer works together with operators to ensure the highest quality in printed circuit board product standards.
SMT basic process:
Solder paste printing
Part mount
Reflow soldering
The board 
Our advantage:
● One stop Turnkey Service
● Quick turn PCB Assembly
● Quality Assurance
● Global components procurement database
● PCB manufacturing in various fields
PCB Assembly Production Process
1. Material examination and preparation
POE  Parts Procurement team works concurrently with our PCB Fabrication team to ensure that all assembly materials are received and ready for use as soon as the bare PCBs are ready for assembly. As parts are received at POE production facility, our Incoming Quality Control (IQC) team conducts a thorough inspection before warehousing any particular material or component.
Inspections include sample operational testing as well as date code verification and entry into a software material management system. Our sophisticated software management system ensures that rules of first-in-first-out are strictly followed, and that parts used in PCB Assembly are always in good working order.
2. Stencil preparation
We use a stencil in PCB SMT assembly so that we can perform solder paste printing at a fixed position. So, we prepare the stencil as per our placements of solder pads.
3.SMT Solder paste printing
Solder paste is basically a mixture of tin and flux. Used to connect pads and electronic components on the PCB. The first step in the actual PCB assembly process is to apply solder paste to the bare PCB. A stainless steel stencil created during PCB fabrication is mounted on the bare board, leaving only the pads for assembling surface mount components. The stencil is held in place by mechanical fixtures, and the applicator moves across the board surface to finely distribute the solder paste over those uncovered spaces.
POE quality control team then performs a thorough inspection to ensure that the solder has only been applied to the necessary areas, and that all pads are covered with a sufficient amount of paste. For double-sided SMT boards, this process will need to be performed individually for each side, as indicated in the above flowchart.
POE solder of choice is DELTA the best solder paste in China and worldwide , which is a Lead-Free alloy containing 96.5% tin, 3% silver, and 0.5% copper, and is compliant with the RoHS, REACH, and JEIDA directives. We use the paste version of this material for reflow soldering, and solid versions for manual and wave soldering.
4. SMT placement
Once solder paste is applied to the bare PCBs, they are moved to POE’s automated Pick & Place machines for the actual mounting of components on their associated pads. Part placement is 100% machine automated for maximum accuracy and efficiency, and uses the project’s pickplace file for component coordinates and rotation data. The boards are again inspected after components have been mounted to ensure all placements are accurate before the soldering process begins.
5. Reflow soldering
After placing the components on the PCB, we place them in a reflow soldering oven. The heating is done in various stages. And each stage refers to a specific heating zone. So, these stages are as follows:
Pre-heat Zone
Soaking Zone
Reflow Zone
Cooling Zone
If the PCB is double-sided then we might have to repeat all of these processes for the other side as well.
6.AOI Automatic Optical Inspection
POE new AOI automatic optical inspection machines are running now for both prototype PCB and mass production. POE 100% AOI tested PCBAs:Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects.
7.X-Ray Inspection
After a reflow cycle, any boards including BGA, QFN, or other lead-less package types are sent for X-Ray Inspection. 
X-Rays penetrate the silicon of an IC package and reflect from the metal connections underneath, forming an image of the solder joints themselves that can be analyzed by advanced image processing software similar to Automated Optical Inspection (AOI). Higher-density features in the captured area create a darker resulting image, allowing for quantitative analysis to determine quality of the solder joints and compare against industry standards. 
Not only does X-Ray inspection detect issues in PCB assembly, but the analysis of an X-Ray image can help to determine the root cause of a given defect, such as insufficient solder paste, skewed part placement, or improper reflow profile. 
8.Wave Soldering
Wave soldering is a method of PCB Assembly that involves sending boards on a conveyor through a “wave” of molten solder. The solder bonds together exposed component pads and leads while wicking off of the bodies of components and the solder masked bulk of the board. 
The growing popularity of surface mount parts and HDI PCB layouts make reflow soldering the method of choice for a majority of projects, and manual soldering can be used to take care of the typically few components not suitable for reflow. 
For traditional boards that require a high percentage of through-hole assembly, as well as boards that contain large connectors with very high pin counts, wave soldering generally remains the most efficient method of PCB assembly. 
9. Cleaning and Inspecting
Then we clean the PCBs and look for any inherent defects. If no defects are found then the PCB is good to go. Otherwise, we will have to perform repair or rework. Therefore, we use various equipment for performing the inspection. These include AXI, X-ray machine, Automated Optical Inspection, etc.
Best PCB Prototype Services Capability
Surface Mount Technology
POE all products follow IPC2 standards.With 18 years experience of placing BGA, UBGA, CSP and small profile passives down to and including 0201, POE offers a cost effective high yield solution to any SMT requirement.
Pin Through Hole
Capabilities to place tape and reeled radial components sizes. Maximum PCB size is 40" x 40". Placement rates reach 15000 pieces per hour with an accuracy of 99% minimizing component loss.
RoHS Regulations
POE have 2 kinds of solutions. Leadfree and leaded soldering process. Each solutions room are divided into 2 seperated places. so there is no mix up.
Selective Wave Solder
Having the Selective Wave soldering machines, POE achieves consistent quality and process control when assembling boards having multiple ground and power planes, high-current connectors or A-typical distribution of components. All AOI tested before QC.IPQC.
Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non conductive dielectric layer that is applied onto the printed circuit board assembly to protect the electronic assembly from damage due to contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments. When coated, it is clearly visible as a clear and shiny material.
Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts, plastics, casings and print & packaging material
PCB Assembly Capabilities
The main SMT production line consists of automated high-precision state-of-the-art equipments from PanasonIC,Sumsung, Japan total 6 lines (Smallest SMT components size can reach to 0201,capable of 0.6mm*0.3mm ~ 50mm*50mmQFP, 0.15mm gap, ±0.05 accuracy ), Daily capacity can reach to 11,000,000 millions components.
Our engineering team has extensive experience in DFM/DFA/DFT technologies. SMT, BGA Rework, Re-balling, X-Ray are all readily achieveable. Stencils can be cut and delivered inside of 4 hours. 
Turn Times
Same day through four week turns Scheduled deliveries
No minimum order quantity
Engineering prototypes
Low cost first article builds
RoHS Regulations
Partial Turnkey
Assembly Types
Surface Mount (SMT)
Mixed Technology (SMT/Thru-hole)
Single or double sided placement
Component Types Passive Components
As small as 0402 package
As small as 0201 with design review
Solder Types
Lead-free/RoHS compliant
No-clean process available
Laser cut stainless steel
Nano-coating available
Ball Grid Arrays (BGA)
As small as .35mm pitch
All BGA placements are x-ray inspected
 Other Capabilities
Repair/Rework services
Mechanical Assembly
Electromechanical Assembly
Testing Capabilities
Each circuit board passes through a complete testing mechanism. The testing processes include in-circuit testing and 100% functional testing. Further, we look at calibration/ adjustment, parameter setting, optoelectronic assembly controls.
Here are major testing process of POE:
  • AOI (Automated Optical Inspection)
  • AXI (Automated X-ray Inspection)
  • Flying Probe
  • HP TestJet Technology
  • ICT (In-Circuit Test)
  • Life Cycle Testing
  • Screening Techniques
  • ESS (Environmental Stress Screening)
  • HALT (Highly Accelerated Life Test)
  • HASS (Highly Accelerated Stress Screening)
  • Test Development
  • Visual Inspection