What is the difference between HDI board and ordinary PCB


HDI board (High Density Interconnector), that is, high -density interconnection board, is a circuit board with a relatively high circuit density with micro -blind burial technology. The HDI board has the inner layer and outer lines, and then the drilling holes and metalization in the hole are used to achieve the connection inside each layer of lines.

The HDI board is generally made of accumulation method. The more times the accumulation layer, the higher the technology of the board. Ordinary HDI PCB boards are basically one accumulation. The high -end HDI uses two or more accumulated technologies, and at the same time, advanced PCB technology such as stacked holes, plating filling, and laser direct punching.

When the density of the PCB increases by more than eight -layer board, it is made by HDI, and its cost is low for the traditional complex compact process. The HDI board is conducive to the use of advanced installation technology, and its electrical performance and signal are more correct than traditional PCB. In addition, HDI boards have improved better for radio frequency interference, electromagnetic wave interference, electrostatic release, and thermal conduction.

Electronic products are constantly developing towards high -density and high precision. The so -called "high", in addition to improving the performance of the machine, also reduces the volume of the machine. High -density integration (HDI) technology can make terminal product design more miniaturized, while meeting higher standards for electronic performance and efficiency. At present, popular electronics, such as mobile phones, digital (camera), laptops, car electronics, etc., many of them use HDI boards. With the replacement of electronic products and the needs of the market, the development of the HDI board will be very rapid.


Ordinary PCB

PCB (Printed Circuit Board), the Chinese name is a printed circuit board, also known as the printing circuit board, is an important electronic component, a supporting body for electronic components, and a carrier for electronic components. Because it is made of electronic printing, it is called a "print" circuit board.

Its role is mainly after the electronic equipment uses the printed board. Because the consistency of the similar printed board, it avoids the errors of artificial wiring, and can realize the automatic installation or paste, automatic welding, and automatic detection of electronic components to ensure that it is guaranteed The quality of electronic equipment has improved labor productivity, reduced costs, and facilitated maintenance.

Are the PCB boards with blind buried holes called HDI boards?

The HDI board is a high -density interconnection circuit board. The blind hole electroplating and the secondary pressure board are all HDI boards. HDI, such as one -order, second, third, fourth, fifth, and other HDI. HDI. Simple buried holes are not necessarily HDI.

How to distinguish between the first and second and third -order HDI PCB

The first -order is relatively simple, and the processes and processes are easy to control.

The second order began to cause trouble, one is the problem of the position, the other is the problem of punching and copper plating. There are many second -order design. One is the wrong position of each order. When connecting the secondary neighborhood, it is connected to the middle layer through the wire. The method is equivalent to two first -order HDI.

The second is that the two -order holes are overlapped. The second -order is realized by the superposition method. The processing is similar to the two first -order, but there are many key points of the process.

The third type is to punch perforation directly from the outer layer to the third layer (or N-2 layer). There are many different techniques from the front, and the difficulty of punching is even more difficult.

The third -order push is the third -order push.

The difference between HDI board and ordinary PCB

Ordinary PCB boards are mainly FR-4, which are compressed by epoxy resin and electronic-grade glass cloth. Generally, the traditional HDI should be used to use glue copper foil at the outermost. Because laser drilling, it cannot open the glass cloth. Essence This is no different from ordinary materials.