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ICT vs FPT: The Core Differences in PCB Assembly Testing Methods

In PCB assembly production, testing is a critical step in ensuring product quality. Two common testing methods are ICT (In-Circuit Test) and FPT (Functional Test). They have different purposes, are used in different phases, and cover different test contents.

ICT (In-Circuit Test)

ICT is primarily used to verify soldering quality and correct component assembly, and is typically performed after the SMT or DIP process is completed.

ICT Test Contents:

Component polarity, value, resistance, capacitance, and inductance

Open/short solder joints

IC soldering condition

Circuit network connectivity

ICT testing is fast and highly automated, making it suitable for mass production and capable of quickly locating defective points. It is particularly well-suited for mid-production testing.

FPT (Functional Test)

FPT performs functional verification on the entire PCBA, simulating actual product application scenarios.

FPT testing content:

Power on

Signal input and output

Communication and control functions

Button, interface, and sensor testing

Program function verification

FPT ensures product operation and can be customized with fixtures, software, and load devices, offering a high degree of customization and closer alignment with end-use scenarios. FPT testing is particularly suitable for final pre-shipment testing.

ICT vs. FPT comparison at a glance

Comparison Item
ICT (In-Circuit Test)
FPT (Functional Test)
Test Objective
Component and solder joint quality
Overall product functionality
Test Stage
Mid-production inspection
Final stage / finished product testing
Test Accuracy
High, can locate specific components
Medium to high, verifies system-level performance
Customization
Standard fixtures are sufficient
Requires test programs/fixtures based on product
Suitable Production Type
Mass production
Small to medium batches or customized products
Fault Diagnosis
Fast and precise
Requires analysis and experience

Can these two tests be used together? In the high-quality PCBA supply chain, the following are generally recommended:
✔ ICT for quality screening and solder defect detection
✔ FPT for functional confirmation and finished product release

For demanding industries such as industrial control boards, automotive electronics, medical devices, and communications equipment, these two tests are often used in combination to ensure circuit correctness and stable functionality.

PCBAMake's Service Capabilities

We support customers with the following testing solutions:

✔ICT in-circuit testing

✔FPT functional testing (customizable fixtures)

✔Flying probe testing (suitable for small batches)

✔Burning-in testing and program programming

✔SMT + testing + packaging, one-stop service

Whether you need mass production control or functional verification, PCBAMake can provide the optimal solution based on your product's characteristics.


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