PCBA aging test method
During the PCBA processing process, we often find that the functional indicators of the PCBA board during the shipment process are normal, but after a period of use, customers find that there will be many bad situations and propose to return to the factory for maintenance. After finding the cause and other operations, you will find that the PCBA may have been aging and cannot operate normally and quickly. Therefore, it is necessary for the aging test of PCBA processing products.
What aging testing?
Special integrated circuit (ASIC) is an integrated circuit specially designed for specific applications-as the name suggests. Therefore, testing these circuits on the printing circuit board has become a very critical and complicated task. The aging test played here.
Check the reliability of ASIC by performing aging testing technology. This test method is usually performed at a temperature of 125 ° C (257 ° F). Execute the test when applying the power and electrical signals to these special ICs.
Basically, this technology is performed before using different components. In this test method, the component was tested by pressure. This helps ensure the reliability of components and PCB.
During the aging test, the IC placed on the board was under tremendous pressure. This helps identify defects and failures. These boards can withstand high temperature during the test. In this process, the temperature remains as high as 257 ° F (125 ° C). Similarly, in the process, put these boards in the old furnace. Provide the necessary voltage for the sample to be tested. After completing this pressure test, the sample will be screened. This helps to ensure whether they have passed the oven test.
PCBA aging test method:
1. Put the PCBA board at the ambient temperature into the thermal aging equipment at the same temperature, and run the PCBA board.
2. Reduce the temperature in the device at a prescribed rate to the specified temperature value. When the temperature in the device reaches stable, the PCBA board should be maintained for two hours at low temperature exposure.
3. Grow the temperature in the device to the prescribed temperature at a prescribed rate. When the temperature in the device reaches stable, the PCBA board should be exposed at high temperature for 2h.
4. Put the temperature in the equipment to room temperature at a prescribed rate, repeat continuously until the specified aging time, and measure and record the PCBA board at the prescribed aging time.
This is the specific steps of the PCBA aging test method. These steps should be performed before the factory. PCBAMAKE pcba manufacturer has treated customers in honesty for many years. The circuit board is handed in the customer's hands!