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SMT patch processing and packaging

pcb package

Packages that are prone to problems in SMT patch processing mainly include the following:
QFN (Quad Flat No-Lead Package): The most common undesirable phenomena are bridging, virtual soldering, etc.
For components with dense pins: such as SOP and QFP below 0.65mm, the most common undesirable phenomena are bridging, virtual soldering, etc.
Large pitch and large size BGA (ball grid array package): The most common undesirable phenomenon is stress fracture of solder joints.
Small-pitch BGA: The most common undesirable phenomena are bridging, virtual soldering, etc.
Long fine-pitch surface-mount connectors: The most common undesirable phenomena are bridging, virtual soldering, etc.
Micro switches and sockets: A common abnormality is the presence of rosin in electronic components.
These packages are prone to problems during SMT chip processing, mainly due to bridging of fine-pitch electronic components, cracking of solder joints of large-pitch BGAs, bridging and virtual soldering of small-pitch BGAs and large-pitch BGA assembly, and fine-pitch connections. It is caused by key factors such as bridging and open soldering of devices, as well as rosin entering micro switches and sockets. Therefore, during SMT chip processing, special attention needs to be paid to these packages and reasonable process flows and standardized operations must be followed to ensure processing quality and reliability.

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