• hdi1
  • hdi4
  • hdi3
  • hdi2
  • hdi5
  • hdi5

Ceramic PCB

The superior thermal conductivity of ceramics pcb is the main reason why more and more industries shift to ceramics for PCB design.

Material: FR4 / FR4 TG180 / FR4 TG170
Finish treatment: Immersion Gold
Copper thickness: 1oz~ 2oz
Resin plugging vias & Buried vias
Impedance Controller Board

Ceramic PCB – Technical specification
Feature Technical specification
Number of layers 4 - 22 layers standard, 40 layers advanced
Technology highlights Multilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing microvias to only penetrate select layers and also be placed in surface pads.
Ceramic PCB 1+N+1, 2+N+2, 3+N+3,4+N+4, any layer in R&D
Materials FR4 standard, FR4 high performance, Halogen free FR4, Rogers
Copper weights (finished) 18μm - 70μm
Minimum track and gap 0.075mm / 0.075mm
PCB thickness 0.40mm - 3.20mm
Maximum dimensions 610mm x 450mm; dependent upon laser drilling machine
Surface finishes available OSP, ENIG, Immersion tin, Immersion silver, Gold fingers
Minimum mechanical drill 0.15mm
Minimum laser drill 0.10mm standard, 0.075mm advanced
Ceramic PCB

With continued demands for miniaturization, microelectronics, and high-power LED packaging, substrates that can withstand high operating temperatures while providing excellent thermal performance are required. Ceramic PCBs have become a more viable option for PCB designers.

Ceramics have been widely used in electronic/electronic components for many years due to their advantages in thermal and mechanical properties. Since its introduction, ceramic PCBs have received great attention from the industry as an effective solution to a range of electronic problems.

Advantages of ceramic pcb compared to other technologies

Heat dissipation is a key advantage of ceramics over traditional materials such as FR4 and metal-clad PCBs. Since the components are placed directly on the board and there are no isolation layers, the heat flow through the board is much more efficient.

In addition to this, ceramic materials can withstand high operating temperatures (up to 500°C) and have an extremely low coefficient of thermal expansion (CTE), providing additional compatibility options for circuit designs.

Ceramic pcb advantage performance parameters

Excellent thermal conductivity (up to 170W/mK)

Operating temperature up to 500°C

Low thermal expansion coefficient

Suitable for high frequency applications due to low signal loss

The water absorption rate is 0%, and it is sealed and packaged with good air tightness.

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